Manufacture Apparatus And Manufacture Method Of Flexible Printed Circuit Board

专利摘要:
PURPOSE: An apparatus and a method for manufacturing a flexible printed circuit board(PCB) are provided to reduce the size of equipment by precisely forming a circuit pattern. CONSTITUTION: A copper coil(40) is adhered and fixed to a PCB resin(78). A surface of the copper coil(40) provided on the PCB resin(78) is washed by a washing unit(50). The washed surface of the copper coil(40) is transferred by a clipper and an elevating unit(54) and dipped to a photoresist(42) of a dipping unit to coat the surface of the copper coil(40) with the photoresist(42). The photoresist(42) coated on the copper coil(40) is dried out by a drying unit(64). A circuit diagram film(44) is adhered to the dried photoresist(42) and exposed by an exposing unit(66). The circuit diagram film(44) is separated from the exposed photoresist(42) and a part except for the photoresist is developed by a developing unit(70) to be eliminated. The copper coil(40) on which the photoresist(42) is not formed is corroded by a corroding unit(74). The photoresist(42) is stripped.
公开号:KR20020030340A
申请号:KR1020000060930
申请日:2000-10-17
公开日:2002-04-25
发明作者:박동순
申请人:박동순；
IPC主号:

专利说明:

Manufacturing Apparatus And Manufacture Method Of Flexible Printed Circuit Board
[24] The present invention relates to a manufacturing apparatus and a manufacturing method of a flexible printed circuit board, and more particularly, it is possible to miniaturize the device by miniaturizing and precisely forming the circuit pattern, reduce the production cost thereof, The present invention relates to a manufacturing apparatus and a manufacturing method of a flexible printed circuit board, which is made to be automated and made simple.
[25] In general, an etching method and a plating method are used as a method of manufacturing a printed circuit board (PCB).
[26] In the above etching method, a printed circuit board is manufactured by stacking a copper plate which is a conductor on an insulating material of a polymer resin, and dissolving and removing unnecessary portions of the copper plate as a corrosion solution to leave only necessary conductor patterns.
[27] This etching method is a technique that is widely used because of excellent mass productivity, the accompanying drawings, Figures 1 to 3 is a view showing a manufacturing process and manufacturing apparatus of a conventional flexible printed circuit board.
[28] As shown, when manufacturing a flexible printed circuit board, first, as shown in the accompanying drawings, the photosensitive liquid 8 and the protective film (4, 6) is provided in the center, upper and lower, respectively, as shown in Figure 2 Prepare (2).
[29] The photosensitive liquid 8 of the dry film 2 is attached onto the copper plate 14 in a state where the lower protective film 6 of the dry film 2 prepared as described above is peeled off.
[30] Subsequently, as shown in FIG. 2, the copper plate 14 and the dry film 2 are firmly attached and fixed to each other. The dry film is subjected to the pressing process by the pressing means 20. (2) is inserted between the rollers 22 of the crimping means 20 with the copper plate 14 attached.
[31] The circuit board film 10 having the circuit pattern 12 formed on the upper surface of the upper protective film 4 of the fixed dry film 2 is firmly attached to the copper plate 14 by the crimping means 20. Equipped.
[32] As shown in FIG. 4, the dry film 2 having the circuit diagram film 10 attached thereto and attached thereto is subjected to exposure treatment by the exposure means 24 made of the light source 26. The photoresist 8 is cured into a shape corresponding to the circuit pattern 12 of the circuit diagram film 10.
[33] Subsequently, the circuit diagram film 10 and the upper protective film 4 of the dry film 2 are separated from the upper surface of the photoresist 8 of the dry film 2 having the exposure process as described above and engraved with the circuit pattern 12. After this, by using the developing means, portions other than the cured portion of the photosensitive liquid 8 in accordance with the circuit pattern 12 are developed and removed by a conventional developing method.
[34] On the other hand, after developing the photosensitive liquid 8 according to the circuit pattern 12 as described above, as shown in Figure 2, the copper plate 14 is subjected to the corrosion process by the corrosion means 28, The corrosion solution sprayed from the nozzle 30 by the corrosion means 28 is removed by contacting the copper plate 14 of the remaining portion except for the portion where the photosensitive liquid 8 is formed on the copper plate 14.
[35] Then, the copper plate 14 is formed in the same shape as the photosensitive liquid 8 corresponding to the circuit pattern 12 by the corrosion means 28, and the copper plate 14 thus formed is provided in the printed circuit board resin Mainly, a completed flexible printed circuit board is produced.
[36] However, the manufacturing process and the manufacturing apparatus of the flexible printed circuit board thus formed attach the circuit diagram film 10 repeatedly used by the high viscosity of the photosensitive liquid 8 provided on the dry film 2 directly to the photosensitive liquid 8. It is not possible to go through the exposure process in the state of being attached on the upper protective film 4 of the dry film 2, wherein the light generated from the above-described exposure means 24 is shown in FIG. 10 is straight, but when passing the upper protective film 4 of the dry film 2, the light is refracted and scattered, so that the precise circuit pattern 12 cannot be realized on the photoresist 8, thereby There was a problem in that miniaturization of the flexible printed circuit board could not be achieved, and thus the overall device could not be miniaturized.
[37] In addition, the circuit diagram film 10 is used repeatedly because the same circuit pattern 12 must be formed on a flexible printed circuit board provided in the same type of product, wherein the circuit diagram film 10 is Due to the high viscosity of the photosensitive liquid 8 there is a problem that can not be attached directly to the photosensitive liquid 8 has led to the problems described above.
[38] In addition, in the manufacturing process of the conventional flexible printed circuit board as described above, there is a problem in that the production cost increases because the dry film 2 must be purchased and used separately.
[39] In addition, since the protective film (4,6) of the upper and lower parts of the dry film (2) by the operator manually separated by hand, it must be inserted between the roller 22 of the pressing means 20, its operation is very inconvenient There was a problem that can not be made, the automation of the work.
[40] Accordingly, the present invention has been made to solve the problems of the prior art as described above, it is possible to miniaturize and precisely form a circuit pattern on the photosensitive liquid of the copper plate, thereby miniaturizing the flexible printed circuit board In addition, the device to which the flexible printed circuit board is applied can be miniaturized, and the production cost can be reduced by eliminating the use of dry film, which must be purchased separately, and the work process can be automated by simplifying the work process. It is an object of the present invention to provide an apparatus and method for manufacturing a flexible printed circuit board.
[1] 1 is a flowchart illustrating a manufacturing process of a conventional flexible printed circuit board.
[2] 2 illustrates a manufacturing apparatus according to a manufacturing process of a conventional flexible printed circuit board.
[3] 3 is a view showing a transmission state of light in a conventional exposure process;
[4] 4 is a flowchart illustrating a manufacturing process of a flexible printed circuit board according to the present invention.
[5] 5 is a view showing a manufacturing apparatus according to the present invention;
[6] 6 is a view showing a transmission state of light in the exposure process according to the present invention;
[7] <Description of the symbols for the main parts of the drawings>
[8] 2: dry film 4,6: protective film
[9] 8: photoresist 10: circuit diagram film
[10] 12: pattern 14: copper plate
[11] 20: pressing means 22: roller
[12] 24: exposure means 26: light source
[13] 28: corrosion means 30: nozzle
[14] 40: copper plate 42: photosensitive liquid
[15] 44: schematic film 46: pattern
[16] 50: washing means 52: nozzle
[17] 54: clipper and lifting means 56: dipping means
[18] 58: immersion container 60: photoresist
[19] 62: transfer means 64: drying means
[20] 66: exposure means 68: light source
[21] 70: developing means 72: nozzle
[22] 74: corrosion means 76: nozzle
[23] 78: printed circuit board resin
[41] According to an aspect of the present invention, there is provided a method of manufacturing a flexible printed circuit board, the method comprising: attaching and fixing a copper plate to a printed circuit board resin; A washing step of washing one surface of the copper plate provided in the printed circuit board resin as a washing means by the above-described process; A dipping step of transferring one surface of the copper plate washed by the process as a clipper and elevating means to immerse it in the photosensitive liquid of the dipping means to coat the photosensitive liquid on one surface of the copper plate; A drying step of drying the photosensitive liquid coated on the copper plate by the step as a drying means; An exposure step of attaching a circuit diagram film on the photosensitive liquid dried by the above step and exposing as a exposure means; A developing step of separating the circuit diagram film from the photosensitive liquid exposed by the above step, and then developing and removing portions other than the photosensitive liquid cured according to the circuit pattern as developing means; A corrosion step of causing the copper plate other than the photosensitive solution formed on the copper plate of the photosensitive liquid developed in correspondence with the circuit pattern by the step as a corrosion means; And removing the copper plate-like photosensitive liquid formed corresponding to the circuit pattern by the above process.
[42] In addition, an apparatus for manufacturing a flexible printed circuit board, comprising: cleaning means provided to clean one surface of a copper plate provided in a printed circuit board resin by spraying a cleaning liquid through a nozzle; A clipper and elevating means for holding and transporting the cleaned copper plate on one side of the washing means; Immersion means having a photosensitive liquid stored therein so that the copper plate transferred to one side of the clipper and the lifting means is lowered to coat the photosensitive liquid on one surface of the copper plate; A transfer means provided with a copper plate coated with a photosensitive liquid on one side of the immersion means to be automatically transferred to the upper surface by a clipper and an elevating means; Drying means provided to dry the photosensitive liquid coated on the copper plate at one end of the transfer means; Exposure means comprising a light source provided on one side of the drying means to form a circuit pattern of the circuit diagram film in the photosensitive liquid; Developing means provided at one side of the exposure means to inject a developer through a nozzle to develop and remove a portion other than the photosensitive liquid cured according to the circuit pattern by the exposure means; And a corrosion means provided on one side of the developing means to spray the corrosion solution through the nozzle to corrode portions other than the copper plate corresponding to the photoresist formed in a shape corresponding to the circuit pattern.
[43] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[44] 4 is a flowchart illustrating a manufacturing process of a flexible printed circuit board according to the present invention, FIG. 5 is a view illustrating a manufacturing apparatus according to the present invention, and FIG. 6 is a light during an exposure process according to the present invention. Is a diagram showing a transmission state of
[45] 5 is a view illustrating a manufacturing apparatus of a flexible printed circuit board, and the manufacturing apparatus thereof includes a washing unit 50, a clipper and a lifting unit 54, a dipping unit 56, a conveying unit 62, and drying unit. The means 64, the exposure means 66, the developing means 70, and the corrosion means 74 are roughly formed.
[46] The cleaning means 50 is provided with a plurality of nozzles 52 to spray the cleaning liquid to remove foreign matter on one surface of the copper plate 40 attached to the printed circuit board resin 78.
[47] The clipper and the lifting means 54 is installed so that the upper end is movable on a rail (not shown), and the lower end is provided with a clipper operated on the same principle as the tongs, and the clipper can be lifted up and down. It is designed to be configured.
[48] Therefore, the clipper and the lifting means 54 are provided to grip and transport the printed circuit board resin 78 and the copper plate 40 washed by the cleaning means 50.
[49] In addition, the lower end of the clipper and the lifting means 54 is provided with immersion means 56 for coating the photosensitive liquid 42 on the copper plate 40, the immersion means 56 is the immersion container 58 The photosensitive liquid 42 is stored in the interior thereof.
[50] Therefore, the copper plate 40 is transferred and lowered to the upper portion of the immersion means 56 by the clipper and the lifting means 54 so as to be immersed in the photosensitive liquid 42 in the immersion means 56 for a predetermined time. The photoresist 42 is to be coated on the surface.
[51] In addition, one side of the immersion means 56 is provided with a conveying means 62 such as a conveyor system is coated with the photosensitive liquid 42 which is transported to the upper surface by the clipper and the lifting means 54 and seated thereon. The copper plate 40 and the printed circuit board resin 78 are automatically transferred.
[52] On the other hand, one end of the transfer means 62 is provided with a drying means 64 for drying the photosensitive liquid 42 coated on the copper plate 40 with warm air, and the drying means 64 It is configured to generate hot air and cold air from the inside and discharge at a constant intensity.
[53] The photosensitive liquid 42 dried by the drying means 64 is hardened and loses viscosity, so that the circuit diagram film 44 repeatedly used on the photosensitive liquid 42 can be directly attached.
[54] In addition, one side of the drying means 64 is provided with an exposure means 66 made of a light source 68 to form the circuit pattern 46 of the circuit diagram film 44 in the photosensitive liquid 42.
[55] The exposure means 66 hardens a portion other than the photosensitive liquid 42 covered by the circuit pattern 46 of the circuit diagram film 44.
[56] In addition, the light generated from the light source 68 of the exposure means 66 passes through the circuit diagram film 44 as shown in FIG. 6 and directly contacts the photosensitive liquid 42 to cure the portion. At this time, since the light is straight and no refraction or scattering occurs, the circuit pattern 46 can be precisely formed on the photosensitive liquid 42, thereby miniaturizing the size of the circuit pattern 46. You can do it.
[57] On the other hand, one side of the exposure means 66 is provided with a developing means 70 for spraying the developing solution through the nozzle 72 to develop and remove the uncured photosensitive liquid 42.
[58] In addition, one side of the developing means 70 is provided with a corrosion means 74 to corrode the copper plate 40 by spraying the corrosion solution through the nozzle 76, the corrosion means 74 is a circuit The copper plate 40 corresponds to the circuit pattern 46 by contacting portions other than the copper plate 40 covered by the photosensitive liquid 42 formed in the same shape as the pattern 46 to corrode the copper plate 40. It is formed as.
[59] In addition, FIG. 4 illustrates a manufacturing process of a flexible printed circuit board, and a process of first attaching and fixing the copper plate 40 to the printed circuit board resin 78 is provided.
[60] Thereafter, a washing process of washing one surface of the copper plate 40 provided in the PCB 78 as described above using the washing means 50 is provided.
[61] In addition, one surface of the copper plate 40 washed as described above is transferred as a clipper and elevating means 54 to be immersed in the photosensitive liquid 42 of the immersion means 56 to provide a photosensitive liquid 42 on one surface of the copper plate 40. A coating dipping process is provided.
[62] As described above, there is provided a drying process of drying the photosensitive liquid 42 coated on the copper plate 40 as the warm air generated by the drying means 64.
[63] The exposure process which attaches the circuit diagram film 44 on the photosensitive liquid 42 which dried and lost viscosity as mentioned above and performs an exposure process as the exposure means 66 is provided.
[64] A developing step is provided in which portions other than the photosensitive liquid 42 that have been exposed and cured in correspondence with the circuit pattern 46 are developed as the developing means 70 and removed as described above.
[65] Corrosion process which is developed as mentioned above and corrodes the part other than the photosensitive liquid 42 which was formed on the copper plate 40 with the photosensitive liquid 42 formed in the shape corresponding to the circuit pattern 46 as corrosion means 74. FIG. Is provided.
[66] The process of peeling and removing the photosensitive liquid 42 on the copper plate 40 formed in the shape corresponding to the circuit pattern 46 by corrosion as mentioned above is provided.
[67] One completed flexible printed circuit board is formed through the above process.
[68] On the other hand, when manufacturing the flexible printed circuit board according to the present invention made as described above, first, the copper plate 40 for forming the circuit pattern 46 to the printed circuit board resin 78 is attached and fixed.
[69] Subsequently, after one surface of the copper plate 40 is positioned at the lower end of the cleaning means 50, and when the cleaning means 50 is operated, a predetermined cleaning liquid is sprayed from the nozzle 52 of the cleaning means 50 to make the copper plate ( The cleaning process to remove the foreign matter on the 40) is performed.
[70] The copper plate 40 and the printed circuit board resin 78 washed as described above are gripped by the clipper and elevating means 54 and moved to the immersion means 56 side, and the copper plate moved to the immersion means 56 side as described above. 40 is locked by inserting one surface of the copper plate 40 into the photosensitive liquid 42 stored in the dip container 58 by the lowering of the clipper and the lifting means 54.
[71] As described above, one surface of the copper plate 40 immersed in the photosensitive liquid 42 of the immersion means 56 is coated with the photosensitive liquid 42, and then the copper plate 40 is again a clipper and a lifting means ( 54, lifted out of the photosensitive liquid 42, moved to one end of the transfer means 62, and the printed circuit board resin 78 is placed on the transfer means 62.
[72] As described above, the transfer means 62 on which the printed circuit board resin 78 and the copper plate 40 are placed is stopped for a predetermined time, and the copper plate 40 at this time is caused by the warm air generated by the drying means 64. The photoresist 42 coated on the copper plate 40 is dried to lose the viscosity of the photoresist 42.
[73] On the other hand, after the photosensitive liquid 42 on the copper plate 40 is dried by the above process, the transfer means 62 is operated again and stopped in the state which moved the copper plate 40 to the next process, and at this time, the copper plate 40 The circuit diagram film 44 in which the circuit pattern 46 is formed is attached and provided on the photosensitive liquid 42 of ().
[74] As described above, the copper plate 40 provided with the circuit diagram film 44 is moved to the exposure process, which is the next process, by the transfer means 62, and the copper plate 40 moved to the exposure process is made of the light source 68. By means 66, portions of the photosensitive liquid 42 other than the photosensitive liquid 42 covered by the circuit pattern 46 of the circuit diagram film 44 are cured.
[75] On the other hand, at this time, the light generated from the light source 68 of the exposure means 66 has a straightness while passing through the circuit diagram film 44, so that refraction and scattering do not occur, so that the circuit pattern on the photosensitive liquid 42 It is possible to form the 46 precisely, thereby miniaturizing the circuit pattern 46.
[76] In addition, the copper plate 40 subjected to the exposure process as described above is moved to the developing process, which is the next process, by the transfer means 62, and the photosensitive liquid 42 of the copper plate 40 moved to the developing process is the developing means 70. The uncured photosensitive liquid 42 is developed and removed by the developer injected from the nozzle 72 of the.
[77] In addition, the copper plate 40 which has undergone the developing process as described above is moved to the next process, the corrosion process, by the conveying means 62, and this corrosion process is the corrosion solution sprayed from the nozzle 76 of the corrosion means 74 is a circuit. The copper plate 40 is formed in a shape corresponding to the circuit pattern 46 by contacting portions other than the copper plate 40 covered by the photosensitive liquid 42 formed in the same shape as the pattern 46 to corrode the copper plate 40. Done.
[78] Thereafter, when the photosensitive liquid 42 of the copper plate 40 formed corresponding to the circuit pattern 46 is peeled off and removed, one flexible printed circuit board is completed.
[79] Accordingly, when the flexible printed circuit board is manufactured, the circuit pattern 46 is precisely formed on the photosensitive liquid 42 of the copper plate 40 by preventing straightening and scattering of light in the exposure means 66 to have straightness. It is possible to form and miniaturize, thereby miniaturizing the flexible printed circuit board and miniaturizing the apparatus to which the flexible printed circuit board is applied.
[80] In addition, since the conventional dry film 2 is not used, production cost can be reduced, and a work process thereof is automated to improve workability.
[81] As described above, the manufacturing apparatus and manufacturing method of the flexible printed circuit board of the present invention can be miniaturized and miniaturized and precisely formed circuit pattern on the photosensitive liquid of the copper plate because the light from the exposure means is going straight. As a result, miniaturization of the flexible printed circuit board and miniaturization of the apparatus to which the flexible printed circuit board is applied can be achieved, production costs can be reduced, and its work process is automated to improve workability. It works.

权利要求:
Claims (2)
[1" claim-type="Currently amended] In the method of manufacturing a flexible printed circuit board,
Attaching and fixing the copper plate 40 to the printed circuit board resin 78;
A washing step of washing one surface of the copper plate 40 provided in the printed circuit board resin 78 as the washing means 50 by the above-described process;
One surface of the copper plate 40 washed by the above process is transferred as a clipper and elevating means 54 to be immersed in the photosensitive liquid 42 of the immersion means 56 to coat the photosensitive liquid 42 on one surface of the copper plate 40. Dipping step to make;
A drying step of drying the photosensitive liquid 42 coated on the copper plate 40 as the drying means 64 by the above process;
An exposure step of attaching the circuit diagram film 44 on the photosensitive liquid 42 dried by the above step and exposing as the exposure means 66;
The circuit diagram film 44 is separated from the photosensitive liquid 42 exposed by the above process, and then a portion other than the photosensitive liquid 42 cured according to the circuit pattern 46 is developed as the developing means 70 to be removed. Developing process;
A corrosion step of causing the copper plate 40 other than the photosensitive liquid 42 to be formed on the copper plate 40 of the photosensitive liquid 42 developed corresponding to the circuit pattern 46 by the above-mentioned process as a corrosion means 74;
And removing the photosensitive liquid (42) on the copper plate (40) formed corresponding to the circuit pattern (46) by the above process.
[2" claim-type="Currently amended] In the manufacturing apparatus of a flexible printed circuit board,
Washing means (50) provided to clean one surface of the copper plate (40) provided in the printed circuit board resin (78) by spraying the cleaning liquid through the nozzle (52);
A clipper and elevating means (54) for holding and transporting the cleaned copper plate (40) on one side of the washing means (50);
Immersion means having the photosensitive liquid 42 stored therein so that the copper plate 40 transferred to one side of the clipper and the lifting means 54 is lowered to coat the photosensitive liquid 42 on one surface of the copper plate 40 ( 56);
A transfer means 62 provided with a copper plate 40 coated with a photosensitive liquid 42 on one side of the immersion means 56 on the upper surface of the copper plate 40 by a clipper and elevating means 54 for automatic transfer;
Drying means (64) provided at one end of the conveying means (62) to dry the photosensitive liquid (42) coated on the copper plate (40);
An exposure means (66) comprising a light source (68) provided at one side of the drying means (64) to form a circuit pattern (46) of the circuit diagram film (44) in the photosensitive liquid (42);
One side of the exposure means 66 is provided to spray the developer through the nozzle 72 to develop and remove portions other than the photosensitive liquid 42 cured by the exposure means 66 according to the circuit pattern 46. Developing means 70;
One side of the developing means 70 is provided to spray the corrosion solution through the nozzle 76 to corrode portions other than the copper plate 40 corresponding to the photosensitive liquid 42 formed in a shape corresponding to the circuit pattern 46. Corrosion means (74); The manufacturing apparatus of the flexible printed circuit board comprising a.

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同族专利:

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公开号 | 公开日

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2000-10-17|Application filed by 박동순

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2000-10-17|Priority to KR1020000060930A

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2002-04-25|Publication of KR20020030340A

优先权:

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申请号 | 申请日 | 专利标题

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KR1020000060930A|KR20020030340A|2000-10-17|2000-10-17|Manufacture Apparatus And Manufacture Method Of Flexible Printed Circuit Board|